Product Center-Tianjin Jiuri New Materials Co., Ltd.

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JIURI NEW MATERIALS

UV curing material

Semiconductor materials

Fine chemicals

JURY

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Type

JRcure

CAS number

Explanation

Detailed Information

2025 “Innovation Knows No Bounds, Growth Speaks Volumes” Speech Contest

TDS/SDS

2025 Headquarter Baishishan Team Building Event

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i-line positive photoresist

JPI-1310

Ultra-high resolution, with a resolution of 0.35 µm.

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i-line positive photoresist

JPI-5104

Film thickness: 0.4 μm; laser direct writing positive photoresist

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TFT-LCD photoresist

JPD-301M1

Film thickness: 1.5 µm; high-sensitivity positive photoresist

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2024 Corporate Team-Building 2-Day Tour to Langyashan and Yishui Lake

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“Accumulate Thoroughly, Unleash Power; Create and Win the Future” – 2025 Annual Conference Highlights

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“Accumulate Thoroughly, Unleash Power; Create and Win the Future” – At the 2025 Annual Conference

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“Shining Voices for a Long Day” Online Reading Competition – On-Site Event

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Behind the Scenes of the First “Glory and Legacy” Speech Contest

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“Glory and Legacy” First-Edition Speech Contest – On-Site

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G-line positive photoresist

JPI-3114

Film thickness: 1.27 micrometers

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G-line positive photoresist

JPI-3228

Film thickness: 3.6 μm; etching-resistant.

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i-line positive photoresist

JPI-2212

High resolution, film thickness of 1.2 μm, etching-resistant

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G-line positive photoresist

JPI-3028

Film thickness: 2.5 micrometers

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G-line positive photoresist

JPI-6118NS

Viscosity 25 cP

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i-line positive photoresist

JPI-4174

Film thickness: 6.0 μm, heat-resistant

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i-line positive photoresist

JPI-1124M

Film thickness: 2.3 micrometers

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Acetophenone derivatives

1114

6175-45-7

Low yellowing, high activity

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Ethylene sulfate

DTD

1072-53-3

Additives for Lithium-Ion Battery Electrolytes

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