Products


JIURI NEW MATERIALS

JURY

Semiconductor materials

Photosensitizer PAC for panels and semiconductor photoresists, intermediate materials

Type

JRcure

CAS number

Explanation

Detailed Information

i-line positive photoresist

JPI-1310

-

Ultra-high resolution, with a resolution of 0.35 µm.

i-line positive photoresist

JPI-5104

-

Film thickness: 0.4 μm; laser direct writing positive photoresist

TFT-LCD photoresist

JPD-301M1

-

Film thickness: 1.5 µm; high-sensitivity positive photoresist

G-line positive photoresist

JPI-3114

-

Film thickness: 1.27 micrometers

G-line positive photoresist

JPI-3228

-

Film thickness: 3.6 μm; etching-resistant.

i-line positive photoresist

JPI-2212

-

High resolution, film thickness of 1.2 μm, etching-resistant

G-line positive photoresist

JPI-3028

-

Film thickness: 2.5 micrometers

G-line positive photoresist

JPI-6118NS

-

Viscosity 25 cP

i-line positive photoresist

JPI-4174

-

Film thickness: 6.0 μm, heat-resistant

i-line positive photoresist

JPI-1124M

-

Film thickness: 2.3 micrometers

Ethylene sulfate

DTD

1072-53-3

Additives for Lithium-Ion Battery Electrolytes

Intermediate

THPE

27955-94-8

Used as an intensifier and a photosensitizer intermediate.

Initiator

JDW4021

478556-66-0

Monitor color filter

Initiator

JDW4011

253585-83

Color filters, display spacers, insulating layers

PAC

BOA520

-

Panels, semiconductors, and chip packaging

PAC

BOA515

-

Panels, semiconductors, and chip packaging

PAC

THPEPAC

138636-85-8

Panels, semiconductors, and chip packaging

g-line positive photoresist

JPI-1124M

-

Photoresist for LEDs, film thickness 2–4 μm

i-line positive photoresist

JPI-4174

-

Good heat resistance, with a coating thickness of 3–10 microns.

i-line positive photoresist

JPI-1124M

-

Film thickness: 2.3 micrometers

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